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tiffany barcelet One single assembly: Incoming test -> screen printing solder paste (dot patch glue) -> patch -> Drying (curing) -> reflow soldering -> cleaning -> testing -> repair

? II, double-sided assembly: A: Incoming inspection -> PCB's an facetscreen printing solder paste (dot patch glue) -> patch -> drying (curing) -> an facetreflow soldering -> Cleaning - > Flap -> PCB B-side printing solder paste (dot patch glue) -> patch -> Drying -> reflow (preferably only B side) -> blank-> ; test -> repair

This process applies to each side of the computerB are affixed with this type of huge SMD PLCC used.

B: Incoming inspection -> PCB's an facetscreen printing solder paste (dot patch glue) -> patch -> drying (curing) -> an facetreflow soldering -> Cleaning - > flap -> PCB SMT B-side point of plastic -> patch -> Curing -> B surface wave -> cleaning -> testing -> repair

This process is appropriate for reflow soldering within the PCB of the an aspect, B side wave soldering. within the PCB assembly SMD B-side, only the SOT or SOIC (28) pin below, should adopt this technology tiffany bracelet heart.

tiffany necklaceThree, single-sided mixed technology: Incoming test -> PCB's an facetscreen printing solder paste (dot patch glue) -> patch -> drying (curing) -> reflow soldering -> cleaning -> Plugins - > wave -> cleaning -> testing -> repair

Four, double-sided mixed technology: A: Incoming inspection -> PCB SMT B-side point of plastic -> Chip -> Curing -> flap -> PCB's an facetplug-ins -> wave -> Cleaning -> test -> repair

Inserted after the basicpaste for SMD components than the location of separated components B: Incoming inspection -> PCB's A surface plug (pin bent) -> flap -> PCB's B noodles rubber patch -> patch -> Curing -> flap -> wave -> cleaning -> testing -> repair

Inserted after the basicpaste for SMD components, discrete components as opposed to the location C: incoming inspection -> PCB's an facetscreen printing paste -> Chip -> Drying -> reflow soldering -> plug, pin bent -> flap -> ; PCB SMT B-side point of plastic -> Chip -> Curing -> flap -> wave -> cleaning -> testing -> repair

a mixtureed side, B side mount. D: incoming inspection -> PCB SMT B-side point of plastic -> Chip -> Curing -> flap -> PCB's an facetscreen printing paste -> Chip - > an facetreflow soldering -> plugins -> B surface wave -> cleaning -> testing -> repair

a mixtureed side, B side mount. First posted two sides SMD, reflow soldering, when Instrumentation, soldering

E: incoming inspection -> PCB's B side screen printing solder paste (point SMD plastic) -> Chip -> drying (curing) -> reflow soldering -> flap -> ; PCB A-side printing paste -> Chip -> Drying -> reflow soldering 1 (can use local welding) -> Plugins -> Wave 2 (as an example, plug less components, can be utilized Hand soldering) -> cleaning -> testing -> repair

A surface mount, B side mixed.

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